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XC3S1000-4FTG256C

Xilinx


ManufacturerXilinx
Manufacturer ModelXilinx-XC3S1000-4FTG256C
Lot number22+
PackageBGA
PartXC3S1000-4FTG256C
PRODUCT CATEGORYEmbedded
DescriptionIC FPGA 173 I/O 256FTBGA
DATASHEETPDF Datasheet

Authentication
The XC3S1000-4FTG256C,from Xilinx,is EmbeddedWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!

Number of I/Os: 173

Number of LABs/CLBs: 1920

Supplier device package: BGA

Installation type: surface mounting

Package/housing: 256-LBGA

Operating temperature: 0 ° C~85 ° C (TJ)

Total RAM bits: 442368

Number of grids: 1000000

Voltage power supply: 1.14 V~1.26 V

Number of logic elements/units: 17280


The XC3S1000-4FTG256C,from Xilinx,is EmbeddedWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!

Number of I/Os: 173

Number of LABs/CLBs: 1920

Supplier device package: BGA

Installation type: surface mounting

Package/housing: 256-LBGA

Operating temperature: 0 ° C~85 ° C (TJ)

Total RAM bits: 442368

Number of grids: 1000000

Voltage power supply: 1.14 V~1.26 V

Number of logic elements/units: 17280


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