XC3S1000-4FTG256C
Manufacturer | Xilinx |
---|---|
Manufacturer Model | Xilinx-XC3S1000-4FTG256C |
Lot number | 22+ |
Package | BGA |
Part | XC3S1000-4FTG256C |
PRODUCT CATEGORY | Embedded |
Description | IC FPGA 173 I/O 256FTBGA |
DATASHEET | PDF Datasheet |
The XC3S1000-4FTG256C,from Xilinx,is EmbeddedWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!
Number of I/Os: 173
Number of LABs/CLBs: 1920
Supplier device package: BGA
Installation type: surface mounting
Package/housing: 256-LBGA
Operating temperature: 0 ° C~85 ° C (TJ)
Total RAM bits: 442368
Number of grids: 1000000
Voltage power supply: 1.14 V~1.26 V
Number of logic elements/units: 17280
Stock:9652
Minimum Order:1
Looking for a lower wholesale price? Send a quick inquiry and we'll get back to you ASAP!The XC3S1000-4FTG256C,from Xilinx,is EmbeddedWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!
Number of I/Os: 173
Number of LABs/CLBs: 1920
Supplier device package: BGA
Installation type: surface mounting
Package/housing: 256-LBGA
Operating temperature: 0 ° C~85 ° C (TJ)
Total RAM bits: 442368
Number of grids: 1000000
Voltage power supply: 1.14 V~1.26 V
Number of logic elements/units: 17280
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