XC7Z045-2FFG900I
| Manufacturer | Xilinx Inc. |
|---|---|
| Manufacturer Model | Xilinx Inc.-XC7Z045-2FFG900I |
| Lot number | 22+ |
| Package | Tray |
| Part | XC7Z045-2FFG900I |
| PRODUCT CATEGORY | embedded-system-on-chip-soc |
| Description | |
| DATASHEET | PDF Datasheet |
Brand: Xilinx
Model: XC7Z045-2FFG900I
Product Parameters:
Manufacturer: Xilinx
Product Category: FPGAs (Field-Programmable Gate Arrays)
Family: Zynq-7000
Series: Zynq-7000 SoC
Number of Logic Cells: 436,200
Number of Slices: 27,600
Number of Flip-Flops: 174,400
Number of Block RAMs: 4,860 Kb
Number of DSP48E1 Slices: 220
Number of I/O Pins: 900
Operating Voltage: 0.95V - 1.05V
Operating Temperature Range: -40°C to +100°C
Package / Case: 900-FBGA (Flip-Chip Ball Grid Array)
Packaging: Tray
Product Description:
The XC7Z045-2FFG900I is a member of the Zynq-7000 SoC (System on Chip) family of FPGAs from Xilinx. It combines a dual-core ARM Cortex-A9 processor with programmable logic, providing a flexible and powerful platform for embedded systems.
With 436,200 logic cells, 27,600 slices, and 174,400 flip-flops, the XC7Z045-2FFG900I offers abundant resources for implementing complex digital designs. It includes 4,860 Kb of block RAM for memory storage and 220 DSP48E1 slices for digital signal processing tasks.
The FPGA features 900 I/O pins, allowing for versatile connectivity options with external devices and peripherals. It operates at an operating voltage range of 0.95V to 1.05V, contributing to efficient power consumption.
The XC7Z045-2FFG900I is packaged in a 900-FBGA (Flip-Chip Ball Grid Array) package, which provides a reliable and high-density interconnection between the FPGA and the printed circuit board.
Please note that this is a general overview, and for more detailed technical information, it is recommended to refer to the datasheet and documentation provided by Xilinx.
Stock:5959
Minimum Order:1
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Model: XC7Z045-2FFG900I
Product Parameters:
Manufacturer: Xilinx
Product Category: FPGAs (Field-Programmable Gate Arrays)
Family: Zynq-7000
Series: Zynq-7000 SoC
Number of Logic Cells: 436,200
Number of Slices: 27,600
Number of Flip-Flops: 174,400
Number of Block RAMs: 4,860 Kb
Number of DSP48E1 Slices: 220
Number of I/O Pins: 900
Operating Voltage: 0.95V - 1.05V
Operating Temperature Range: -40°C to +100°C
Package / Case: 900-FBGA (Flip-Chip Ball Grid Array)
Packaging: Tray
Product Description:
The XC7Z045-2FFG900I is a member of the Zynq-7000 SoC (System on Chip) family of FPGAs from Xilinx. It combines a dual-core ARM Cortex-A9 processor with programmable logic, providing a flexible and powerful platform for embedded systems.
With 436,200 logic cells, 27,600 slices, and 174,400 flip-flops, the XC7Z045-2FFG900I offers abundant resources for implementing complex digital designs. It includes 4,860 Kb of block RAM for memory storage and 220 DSP48E1 slices for digital signal processing tasks.
The FPGA features 900 I/O pins, allowing for versatile connectivity options with external devices and peripherals. It operates at an operating voltage range of 0.95V to 1.05V, contributing to efficient power consumption.
The XC7Z045-2FFG900I is packaged in a 900-FBGA (Flip-Chip Ball Grid Array) package, which provides a reliable and high-density interconnection between the FPGA and the printed circuit board.
Please note that this is a general overview, and for more detailed technical information, it is recommended to refer to the datasheet and documentation provided by Xilinx.
