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XC7A75T-1FGG484I

Xilinx Inc.


ManufacturerXilinx Inc.
Manufacturer ModelXilinx Inc.-XC7A75T-1FGG484I
Lot number22+
PackageTray
PartXC7A75T-1FGG484I
PRODUCT CATEGORYembedded-fpgas-field-programmable-gate-array
Description
DATASHEETPDF Datasheet

Authentication
The XC7A75T-1FGG484I,from Xilinx Inc.,is embedded-fpgas-field-programmable-gate-arrayWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!

Brand: Xilinx Inc.

Model: XC7A75T-1FGG484I 


Product Parameters:

The XC7A75T-1FGG484I is a Field-Programmable Gate Array (FPGA) with a maximum capacity of 73,728 logic cells, 4.86 Mb of block RAM, and 180 DSP slices. Other key parameters of this FPGA include:


Logic Voltage: 1.0V

Number of Logic Cells: 73,728

Number of DSP Slices: 180

Block RAM: 4.86 Mb

Maximum Internal Clock Frequency: 840 MHz

Total On-Chip Power: 6.5W

Package: 484-pin Fine-pitch Ball Grid Array (FBGA)


Product Introduction:

The XC7A75T-1FGG484I is a high-performance FPGA designed for applications that require high-speed connectivity, advanced digital signal processing, and high memory bandwidth. With a maximum capacity of 73,728 logic cells, this FPGA provides designers with the flexibility to implement complex designs with high-speed connectivity.


The FPGA operates at a logic voltage of 1.0V and can run at a maximum internal clock frequency of 840 MHz. This, along with 4.86 Mb of block RAM and 180 DSP slices, enables the device to deliver high-performance computing capabilities.


The XC7A75T-1FGG484I comes in a 484-pin Fine-pitch Ball Grid Array (FBGA) package, which provides a compact and robust form factor for the device. The package also includes advanced thermal management features that ensure reliable operation under varying operating conditions.


Overall, the XC7A75T-1FGG484I is a versatile and high-performance FPGA that offers designers the flexibility to implement complex designs with high-speed connectivity, advanced digital signal processing, and high memory bandwidth. The device's high capacity, clock frequency, and on-chip resources make it an ideal solution for applications requiring high-performance computing and signal processing capabilities.


The XC7A75T-1FGG484I,from Xilinx Inc.,is embedded-fpgas-field-programmable-gate-arrayWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!

Brand: Xilinx Inc.

Model: XC7A75T-1FGG484I 


Product Parameters:

The XC7A75T-1FGG484I is a Field-Programmable Gate Array (FPGA) with a maximum capacity of 73,728 logic cells, 4.86 Mb of block RAM, and 180 DSP slices. Other key parameters of this FPGA include:


Logic Voltage: 1.0V

Number of Logic Cells: 73,728

Number of DSP Slices: 180

Block RAM: 4.86 Mb

Maximum Internal Clock Frequency: 840 MHz

Total On-Chip Power: 6.5W

Package: 484-pin Fine-pitch Ball Grid Array (FBGA)


Product Introduction:

The XC7A75T-1FGG484I is a high-performance FPGA designed for applications that require high-speed connectivity, advanced digital signal processing, and high memory bandwidth. With a maximum capacity of 73,728 logic cells, this FPGA provides designers with the flexibility to implement complex designs with high-speed connectivity.


The FPGA operates at a logic voltage of 1.0V and can run at a maximum internal clock frequency of 840 MHz. This, along with 4.86 Mb of block RAM and 180 DSP slices, enables the device to deliver high-performance computing capabilities.


The XC7A75T-1FGG484I comes in a 484-pin Fine-pitch Ball Grid Array (FBGA) package, which provides a compact and robust form factor for the device. The package also includes advanced thermal management features that ensure reliable operation under varying operating conditions.


Overall, the XC7A75T-1FGG484I is a versatile and high-performance FPGA that offers designers the flexibility to implement complex designs with high-speed connectivity, advanced digital signal processing, and high memory bandwidth. The device's high capacity, clock frequency, and on-chip resources make it an ideal solution for applications requiring high-performance computing and signal processing capabilities.


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